S10
3D hybrid module placement machine
Key Features
- Extensible to mount 3D MID
- Strengthen substrate response capabilities
- Flexible component/variety response capabilities
- Extremely versatile switch ability
Specifications
Support PCB size | L50xW30~L1,330xW510mm |
SMD component range | 0201~120x90mm, BGA, CSP, connectors, other heterosexual parts |
Placement speed | 45,000CPH (in best condition) |
Placement accuracy | ±0.025mm (3σ) |
Maximum number of loaded feeders | 90(converted based on 8mm tape) |
air pressure | 0.45Mpa or above |
Dimensions | L1,250xD1,750xH1,420mm |
weight | 1,200Kg |