YSM20R(PV)
YSM20R(PV)
Key Features
- Single-head solution: Flexible and high-speed, both small components and large wafers can be processed without changing heads, and the production line combination is suitable for both long and short lengths.
- Ultra-high-speed placement capability: 95,000 CPH (Note: Tested under YAMAHA’s optimized conditions).
- The flexible placement head can be optionally configured to meet customers' needs for high efficiency and low-cost production.
- The touch screen mode makes operation more convenient and efficient.
- The high-speed intelligent recognition function makes programming and component parameter setting faster.
Specifications
SMD head | HM: high-speed placement head; FM: flexible multi-function placement head |
Patch score | HM: 10; FM: 5 |
Placement accuracy | ±0.035mm(±0.025mm)Cpk≥1.0(3σ) |
Placement speed | 95,000CPH (two sets of placement heads, under optimal conditions) |
Mounted component range | HM: 0201 ~ W55 × L100mm, height 15mm or less |
| FM: 03015 ~ 55mm L100mm, height within 28mm |
PCB size | When transferring one substrate: L810 × W490 to L50 × W50 |
Maximum number of feeders loaded | Fixed feeder rack: up to 140 (converted based on 8mm tape) |
power supply | 3-phase AC 200/208/220/240/380/400/416V±10% 50/60Hz |
air pressure | 0.45Mpa or above, clean, clean |
Appearance size | L1,374 x W1,843 x H1,445mm |
weight | Approx. 1,800kg |