Σ-G5SⅡ
High-end module placement machine
Key Features
- In the upgrade of the "single head solution", two new rotary placement head types can achieve high productivity: can place ultra-small 0201 (0.25×0.125 mm) size components and large components
- Expanded component detection range to improve placement quality
- Larger internal buffer size and expanded internal board size
- Further detailed revisions and improvements to the stability of the equipment
- Compatible with previous machine models
Specifications
Support PCB size | L50xW84~L610xW250mm (dual-rail model) |
SMD component range | 0201~72x72mm |
Placement speed | 90,000CPH (in the best condition, single track model/double track model) |
Placement accuracy | High-speed universal placement head: ±0.025mm (3σ), multi-function placement head: ±0.015mm (3σ) |
Maximum number of loaded feeders | 120 (converted based on 8mm tape) |
power supply | 3-phase AC 200V ±10% |
air pressure | 0.45Mpa or above |
Dimensions | L 1,280 x W 2,240 x H 1,450mm |
weight | 1,800Kg |