1718MK5
Reflow Oven
Key Features
- Nitrogen/air lead-free reflow soldering system
- Enhanced heating module and fastest cooling ramp
- Save energy and nitrogen
- Simple maintenance design
- Temperature curve in one step
- Built-in ECD-CPK process monitoring tool
- Optional dual-track design to maximize production capacity
Specifications
Number of heating zones | Above: 6 / Below: 6 |
Number of cooling zones | Above: 1
|
substrate width
| 50-610 mm
|
maximum transfer speed | 188cm/min |
Lateral temperature difference | +2°C |
Temperature control accuracy | ‡ 0.1°C |
Track adjustment method | Motor driven, manual control |
operating system | Windows 7 |
Equipment size | W 3 3 0 0 × D 1 3 7 0 × H 1 6 0 0 mm |
equipment weight | About 1650kg |